HP Mini 210-1120TU Notebook Ralink WLAN Driver
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HP Mini 210-1120TU Notebook Ralink WLAN Driver
Wireless communication circuitry typically includes a transmit path and a receive path.
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The transmit path may include filters, an intermediate frequency IF conversion stage, signal modulators, transmit amplifiers, impedance matching circuits to couple the transmit signal to the antenna, and other suitable circuitry to convert the baseband information signal into a modulated wireless signal. The receive path may include filters, receive amplifiers, downmixing circuitry, demodulators, adaptive gain control and other suitable circuitry to translate the receive wireless signal into a baseband receive signal.
The modulation circuitry in the transmit path may include a channel encoder, HP Mini 210-1120TU Notebook Ralink WLAN digital-to-analog converter, and mixer stage.
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The demodulation circuitry in the receive path may include an analog-to-digital converter, an equalizer, and a decoder. Radio modem includes bus interface circuitry, link protocol control circuitry, and baseband controller circuitry suitable for converting between a digital data stream and a baseband information signal.
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The link protocol circuitry and bus interface circuitry take digital data received HP Mini 210-1120TU Notebook Ralink WLAN the connector and provide it to the baseband controller for conversion to a raw baseband signal. The baseband controller also converts the received baseband signals from the wireless communication circuitry into digital data that the link control circuitry and bus interface circuitry provide to the connector In this particular embodiment, the connector is a SIM Subscriber Identity Module style connector typically found in SIM cards used with mobile phones or smart card configurations.
The connector may be a USB connector or may be of any other type suitable for circuit card assemblies. Other connector solutions are certainly possible and will be recognized by those skilled in the art.
Note that these figures are schematic in nature; no specific pin count or definition should be inferred from these figures. Referring again to FIG. The antenna may take the form of a microstrip, a ceramic design, a planar inverted F antenna PIFA HP Mini 210-1120TU Notebook Ralink WLAN, or any of a number of low-profile, wireless RF antennas. It may be desirable to introduce a groundplane in the form of a circuit board to which the wireless circuitry is attached, a high-impedance electromagnetic lattice structure, or possibly even the exterior casing of the parent device.
Examples of antenna materials and designs are described in K.
A variety of antenna technologies may be implemented in the preferred embodiment. In addition to the antennas that may receive and transmit signals in accordance with the Bluetooth and IEEE GPRS refers to a packet transmission technology that will allow end users to remain constantly connected to a cellular network and receive and transmit data at speeds to over Kbps.
The RF antenna may also be configured to transmit and receive per the 3G cellular standard, which is the next generation of mobile communication systems currently under development by the global 3G Partnership Project 3GPP. The 3G standard is based roughly on the GSM cellular standard but is expected to be extended and enhanced for high speed multimedia data services.
Additionally, the RF antenna may alternatively incorporate diversity antenna technology. Antenna diversity generally involves the use of multiple antenna elements whose signals are sampled on a per packet basis so as to select the stronger signal.
Multiple antenna elements may also be implemented to provide antenna redundancy or alternatively, the transmit and receive antenna elements may be separated to account for a noisy antenna design. The components in the preferred embodiment of the invention may be encapsulated in or implemented HP Mini 210-1120TU Notebook Ralink WLAN a variety of materials. The preferred composition is FR-4 printed circuit board material.
Other circuit board materials such as polyimides, glass epoxy, and teflon are certainly feasible. Additionally, other plastics such as PVC and materials used in credit card and smart card manufacturing are also possible.
Another embodiment of the wireless link adapter may incorporate the antenna into the exterior surface of the adapter or into the exterior HP Mini 210-1120TU Notebook Ralink WLAN of the parent device, thereby eliminating the need for a dedicated antenna and transducer housing Thermoplastics impregnated with conductive material may be molded onto the exterior of the adapter Alternatively, the conductive material which functions as the RF antenna may be electro-deposited or vapor deposited on the exterior surface of the adapter In another embodiment, the antenna material may be deposited, molded, or otherwise applied in the shape of a company logo The HP Mini 210-1120TU Notebook Ralink WLAN thickness of the adapter is expected to be on the order of about 2 mm and the size to be roughly that of a credit card or smaller.
The external configuration of the adapter allows for easy standardization across product lines and device types.
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Furthermore, the adapter can be installed during manufacture, at the point of sale, or by the customer as an upgrade option. In either case, the fully integrated wireless link adapter is ready for use and is installed without the need for antenna assembly, alignment, or tuning. In a preferred embodiment, the transducer is positioned near the HP Mini 210-1120TU Notebook Ralink WLAN edge of the display area of the portable computer Installation of the preferred embodiment of the wireless link adapter into a parent device such as a portable computer is shown in FIG.
During installation, the adapter slides into a recess in the computer